Product Description
The technology of producing copper foam by
Shanghai Winfay
New Material Co., Ltdis built on a lace microstructure
which improves properties found in standard metal foams. It
represents a new lightweight / high performance wick platform that
solves some of the most critical thermal management challenges in
the electronics sector.Copper Foam are particularly fitted to
replace the current copper powder-based wick structures used
industry-wide in heat pipes and vapor chambers. Below is the
conventional evaluation of copper foam made by Shanghai Winfay.
Porosity: 5—**0 PPI (pores per inch)
Density: 0.*5~0.*5g/cm3
Cavity: *0%—*8%
Element: Cu+Ni, Cu+Al, Cu+Zn
Volume: **0×**0×1—**0mm Feature:
1. Excellent mechanical property and processability;
2. Extraordinary electricity and heat conductivity;
3. Massive intricate, lattice-like inner structure
4. The excellent ability of corrosion resistance, superior tensile
strength, favorable ductility;
5. Magnificent electromagnetic shielding ability. Special
specification are available upon request.
Country: |
China |
Model No: |
Copper Foam 1
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FOB Price: |
(Negotiable)
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