Product Description

Features:
Base material: aluminum
Layer count: single-sided
Board thickness: 2.*0mm (finished)
Base material thickness: 1.*0mm
Copper thickness: 2oz
Surface finish: immersion gold
Solder mask color: white
Size: *0 x *0mm/1 up
Available base material: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (maximum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishes: HAL, ENIG, OSP, gold finger and chemistry tin
Possible solder mask colors: green, black, white, yellow and blue
Board dimension: **0 x 1,**0mm
Hole diameter: 0.2mm (minimum)
Line width: 0.**5mm (minimum)
Line spacing: 0.**5mm (minimum)
SMT pitch: *0 degrees (minimum)
Annular ring: 0.*5mm (minimum)
Aspect ratio: *1:*1
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.*5mm
Hole tolerance (NPTH): 0.*5mm
SM tolerance (LPI)
With electrical test
RoHS directive-compliant
SMT device mounting is available