Product Description

Features:
0.aluminium alloy socket.
1. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,MTK,Intel, etc*-eMCP
2. Apply to BGA**2.
3. Accurate positioning on flat bottom pad and solder of eMCP.
4. Long operating life,up to *0,**0 times.
5. Apply to eMCP thickness:0.***1.5mm.
6. Could reading and writing the data of eMCP with it.
7. eMCP size : *1.5X*3mm,pitch:0.5mm.
8. Easy to operate,insert with the SD card reader into your PC, then could read.
9. Support flat bottom and solder ball testing.

We provide all kinds of IC test socket , eMMC/eMCP socket , SOP socket , TSOP socket , BGA socket and reballing fixture etc .







We're the original manufacturer , we can provide the excellent quality and  competitive price , if you have any inquiry , please don't hesitate to contact us ! ! !