Product Description

- High acquisition and tracking sensitivity - High sensitivity for indoor fixes - Low power consumption - Real-time navigation for location-based services - Extremely fast TTFFs at low signal levels - Highly integrated component - Automatic pick and place assembly - Reflow solderable - Maximum flexibility - Extensively configurable - EMI shielded - **0,**0+ effective correlators for fast TTFF - Supports **-channel GPS receiver - Digital, RF and 4Mb Flash in a single package(GSC3f_LP IC) - GSC3f_LP IC with ARM7TDMI inside - 3 GPIO ports - Integrated TCXO (± 0.5 ppm) - Adaptive trickle power mode, Push-to-Fix, Advanced Power Management - SBAS (WAAS and EGNOS) support - Small size *6mm X *3mm X 2.8 mm SiRFSTARIII