Product Description

Features:
1, the device is small, compact, modular structure design, convenient system integration and equipment maintenance;
2, the new semiconductor laser source, a small current supply, pump module long life, high efficiency of electro-optical conversion, the whole power consumption is small;
3, laser ultra clean laboratory packaging is completed, the laser output stability, to meet the processing of laser mandarin wood material;
4, processing thermal effect deformation is small, suitable for high precision machining
Technical Information:
model
HY*****2 / 3/5/8
Laser wavelength
**5nm
Maximum laser power
2W / 3W / 5W / 7W / *0W
Beam quality
M² **0μJ (*0KHZ)
repeat frequency
*****0KHZ
Engraved range
*0mm * *0mm / **0mm * **0mm
Write speed
≤ ***0mm / s
Minimum line width
0.*1mm
Minimum character
0.1mm
Power supply
AC**0V / ****0HZ
Power consumption
***0W
For the industry: glass products, electronic appliances, lamps, flexible circuit board cutting marking, 3C and other industries.