PRINTED CIRCUITED BOARD PARAMETERS

Material used: FR4, High Tg Minimum **0C, Hifrequency, Metal based: Aluminium ect.

Maximum Panel Size: *6" X *6" (**0mm X **0mm)

Line Width & Spacing:

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples

Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Layer Count & Thickness: ***2 layers

Minimum Thickness (2 Layers): 4 mil (0.1 mm)

Minimum Thickness (4 Layers): *2 mil (0.3 mm)

Minimum Thickness (6 Layers): *6 mil (0.4 mm)

Minimum Thickness (8 Layers): *4 mil (0.6 mm)

Maximum Thickness(*0layers): **0 mil (5.0 mm)

Layer to Layer Registration: +/- 5 mil (0.*3 mm)

Via / Drill Size: Minimum Drill Hole Diameter *0 mil (0.*5 mm)

Minimum Via Size: 8 mil (0.2 mm)

Hole to Hole Tolerance: +/- 3 mil (0.*8 mm)

Hole to Edge Tolerance: +/- 5 mil (0.*3 mm)

Micro Via: 4 mil (0.1 mm)

Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.*7 mm)

Warpage: 0.5 %

Impedance: +/- *0%

Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU **6 AX) / Immersion Tin

Min. SMT Ptich: *2 mil (0.2 mm)

Min. parts footpins: ***1

Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.