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Dalian Jafeng Semiconductor Device Co., Ltd

    
Die bonder used for ICs and LED Package

Die bonder used for ICs and LED Package


[HS-DC02] [China]
Posted Date: June 23, 2008
Free Member  |  Rate this company
   
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Description
for IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package;


Specifications:

* UPH: 18000
* Wafer: Max 8 inches (200mm)
* Bonding Accuracy: ?30μm, ? 3 degree
* Die Size: 0.15mm*0.15mm-2mm*2mm
* Dimension of Leadframe:
Length: 100-260mm
Width: 10-70mm
Thickness: 0.1-1mm
* Machine Size:1810*1035*1446mm
* Bonding Power: 30-2000g
* Compressed Air: 0.5MPa ?
* Voltage: 220VAC
* Power: 1800 W
 
 
Other Information
Location:  China 
Minimum Order:   
Price for Minimum Order:   
  (This price is only for minimum order, for large quantities, please contact)
Sample Available:  NO 
Related Categories: Electronic Instrument, Semiconductors
Related Products: die bonder, die attach »
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