Product Description

• Thickness: 0.**1.6mm
• Minimum trace size: 0.1mm
• Minimum drill: 0.2mm
• With blind and buried holes
• Layers: 1 to *2
• Board finished thicknesses: 0.2 to 7.0mm
• Materials: FR*4, CEM*3, high TG, halogen-free FR4 and Rogers
• Maximum finished board size: **0 x **0mm
• Minimum hole size: *-mil (0.1mm)
• Minimum trace width/space: 3.5/3.*-mil
• Surface finish/treatment: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP
• Copper thicknesses: 0.5 to 6oz
• Solder mask colors: green, yellow, black, white, red and blue
• Copper thickness in hole: >*8um
• Inner packaging: plastic bag (vacuum packing)
• Outline tolerance: ±0.*3mm
• Hole size tolerance: (PTH) ±0.**6 and (NPTH) ±0.*5mm
• With UL marks
• Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
• Profiling: punching, routing, V-cut and beveling