Product Description

Allwin*1 Corp. is a leading supplier of sputter deposition equipment for high technology applications forSemiconductor III-V, II-VI, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. The AccuSputter AW ***0 is designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin*1's new real time AW****0 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every AccuSputter AW ***0 sputtering system is supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service
AccuSputter AW ***0 Proven Sputter Materials:
Al+W ,Cr/SiO2, SiC ,Ti+Au,InSnO ,SiO2 ,Ti/W ,Ti+Au+Ni,Al2O3 ,Mo ,SiO2+O2 ,Ni/Fe+Cu+SiO2,Ag MoSi2 ,Si+N2(Si3N4) ,Ti/W+Au,Au ,Mo2Si5 ,Si+N2+B4C, Ti/W+Au+Ta, C, Mo5Si3 ,Ta ,Ti/W+Al/Si,Cr Ni ,TaC, Ti/W+Ni/Cr+Au,Cr/Co ,Ni/Cr, Ta+Au , Ti/W+Pt,Cr/Au, Ni+Ni/Cr, TaSi2 ,Al+Ti/W+Ag, Cr+Cu, Ni/Fe ,Ta+SiO2 , W+Al2O3,Cr/Si ,Pt, Zr ,Zn,Cr/SiO, TiO2 ,TiO2+Cr, ZnO2
AccuThermo AW ***0 Sputter Key Features:

• Production-proven sputter technology
• Optimum AW****0 System Control
• DC *4V for Motors, Actuator, Relay, Solenoid
• Efficient 8" Delta cathodes, 2 to 6" option
• Full Pallet rotation control with indexing
• High Uniformity and Yield
• DC, RF Sputter, Pulse DC option
• Magnetron and Diode Sputter option
• RF Etch and Bias are optional
• Ultra Clean vacuum system
• Load lock operation
• UHV design
• Flexible for development or production use
• Full range of substrate sizes and shapes
• Various pumping and power options
• Co-sputtering option
• Reactive Sputtering option
• Made in U.S.A.

• Maintenance, Manual, Semi Automatic and Fully Automatic modes.
• Automated calibration of all subsystems.
• Troubleshooting to subassembly levels.
• Programmed comprehensive calibration and diagnostic functions.
• Recipe creation for full automatic wafer processing.
• Automatic decline of improper recipes and process data s.
• Multi-level password protection.
• Storage of multiple recipes and system functions.
• Real-Time process graphics, data acquisition display, and analysis.
• Process Data and Recipe storage automatically to hard drive.
• Easy TC vacuum gauge calibration.
• Positioning Deposition (optional)
• GEM/SECS II (optional)

• Main Frame
• *8" dia. SST chamber top plate with ports for *-inch(4) circle or Delta (3) Cathodes
• Sputter Power Supply,DC or RF or Pulse DC power, RF: **3KW; DC: 5KW or *0KW
• Process Chamber

• Load lock

• Vacuum Systems for process Chamber

• 1 gas line with MFC(Ar, **0 SCCM or Customized)
• New Controller: Allwin*1 Corp.'s AW****0 System PC Control
• New Power Distribution Box: AC**0V /**8V/ 3Phase

• GEM/SECS II function (Software)
• More gas lines with MFC(① N2;② O2;③ Customized)
• Lamp tower alarm with buzzer.
• Mechanical pump or dry pump for process chamber and load lock.
• Independent mechanical pump or dry pump for process chamber.
• Chiller for Cooling plates and table.
• Turbo pump for load lock.
• Load lock Lamp Heating function, Up to **0°C
• Chamber Lamp Heating function, Up to **0°C (Use one cathode port in SST chamber top plate).
• Plasma etch function (before sputter)
• Bias function
• Co-sputter function
• Reactive sputter function
• Transformer for AC **0V to **8V for DC Power Supply (if necessary).