Product Description

Circuit Layer — Printed circuit copper foil Heat Conduction and Dielectric Layer— use minimum thermal resistance to supply electrical insulation. There are two types: Fiberglass support & non-fiberglass support. Aluminum Substrate— it supports the entire structure and conducts the heat. The material is aluminum alloy plate. Note: Other speceial reqirements are available upon request Capability parameter Excellent heat dissipation;Excellent dimensional stability; Excellent mechanical properties; Excellent electromagnetic shielding; Can use external cooling device directly. Mainly uesed in LED lighting circuit; Power supply; Hybrid integrated circuits; Solid State Relays