OMEGA R320 (WCM-320)
The device is intended for slicing of single crystal sapphire
notably of sapphire monocrystals, as well as for slicing of
other hard or superhard materials.
Slicing is done by a diamond coated wire.
Weight of the device: 1310 kg.
Number of wafers from one cycle of cutting pieces: up to
Wire speed: up to 15 m/s;
Length of sliced ingots: up to 150 mm;
Diameter of sliced ingots: up to 320 mm (12,5 inch);