Product Description

Features 1、Adopt infrared weld technology which independent exploration. 2、Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco. 3、Easily operate.Just need one day ***** operation this machine. 4、Don't need weld ***** machine can weld all the component of *5x****0x*0mm. 5、This machine has **0W heating system.widely to**0x**0mm. 6、Infrared heating don't have sirocco flow. Don't impact perimeter small ***** suitable for all of the component, especially Micro BGA component. 7、Definitely can satisfy the computer, the notebook, the electricity swims and so on the BGA sealing off/repairs to request；Specially especially suits to the computer north and south bridge。 1、Inspect the machine and then open it (1) Check if the connection wire of the lamp body, the Temp-sensor and power cable is ok. (2) Turn on the power switch. Allow the T***0A Power-On-Self-Test (POST) to complete. After this, Temperature set-points will display last value used. (3) The front panel has two switches, controls the preheating dish and the infra-red lamp body separately; 2、PC Board Component Removal and Replacement (1) Placed the PCB Board Put the PCB board on the “PCB board holder”, rotate the “holder fasten nut”, fasten it. Move the “PCB board holder” to choose the right position. (2)the Process of unsoldering and repairing ①Adjust the position of the PCB board, make the chip at the centre of the lamp light. Adjust the height of the lamp body, keep the lamp ****0mm from the chip. ②Put the temp-sensor at the edge of the chip, lay a bed of solder flux around the chip and on the temp-sensor, it will make the measured temperature more accurately, at the same time the solder flux will make the soldering chip more perfect, and keep the bonding pad away from conglutinating and having tin wool. ③According to the producing technological requirement or the size of PCB board, adjust the pre-heat dish temperature(adjust