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COG Bonding Machine

FOB Price

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1 Minimum Order

Country:

China

Model No:

XCG53-A1

FOB Price:

(Negotiable) Get Latest Price

Place of Origin:

Price for Minimum Order:

Minimum Order Quantity:

Packaging Detail:

Delivery Time:

at least 8 days

Supplying Ability:

Payment Type:

Product Group :

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Shenzhen Sunsom Automation Equipment Co., Ltd.

China

Free Member

Contact Person Mr. Lan

Fuyong, Shenzhen, Guangdong

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Product Specification

Product Description

Application: The product is used for bonding IC to various LCD. Technical parameters: Operation mode: Single work fixed operation. Temperature parameters : Constant heating first stagetemperature zone RT ***0℃ Rating voltage : AC **0 V ****0Hz Power: 0.*5KW Efficiency: ******0PCS/H Weight: *0 KG Dimension: L**0 x W**1.5 x H**5mm

Country:	China
Model No:	XCG53-A1
FOB Price:	(Negotiable) Get Latest Price
Place of Origin:	-
Price for Minimum Order:	-
Minimum Order Quantity:	1
Packaging Detail:	-
Delivery Time:	at least 8 days
Supplying Ability:	10
Payment Type:	-
Product Group :	-