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COG Bonding Machine

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Country:

China

Model No:

XCG53-A2

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(Negotiable) Get Latest Price

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SHENZHEN SUNSOM AUTOMATION EQUIPMENT CO., LTD.

China

Free Member

Contact Person Mr. Lan

Fuyong, Shenzhen, Guangdong

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Product Specification

Product Description

Application: The machine is used for aligning and pre*-bonding IC driver onto various LCD glasses. Basic Parameter Voltage: AC**0V ****0HZ Rating Power:0.*5KW Pressure:0.**0.8Mpa Stored Parameter: *0 sets Operation Mode: 7" interface Work Mode: Double stations fixed work Alignment System: Cross mark position Aligning Accuracy: ±3um Bond Head: L***5mm W**5mm (Customization) Ambient Treatment: FFU high efficient filtration Fixture: Micrometer adjust X-Y-θaxis IC Tray: 2" 3" 4" Weight:**0kg Dimension:L***0 xW**0x H***0mm

Country:	China
Model No:	XCG53-A2
FOB Price:	(Negotiable) Get Latest Price
Place of Origin:	-
Price for Minimum Order:	-
Minimum Order Quantity:	-
Packaging Detail:	-
Delivery Time:	-
Supplying Ability:	-
Payment Type:	-
Product Group :	-