Product Description

Title: Copper Pyrophosphate Synonyms: Cupric Pyrophosphate, Copper diphosphate Formula:Cu2P2O7.4H2O, Molecular:**3.*1 CAS #: *********6, EINECS #: ********4 Grade: Technical Grade Specifications: Appearance: baby blue or sky blue power Assay (Cu2P2O7.4H2O): *9% min Fe 0.**5% max Pb: 0.***5% max SO4: 0.5% max Package: **5Kgs/bag Properties: Copper pyrophosphate is light green powder, soluble in acid, insoluble in water, can form a water-soluble pyrophosphate complex salt, easy to be sequestered by potassium pyrophosphate. Plating solution has excellent polarizing and current distribution. Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating. Applications: Copper pyrophosphate is mainly used on non-cyanide electroplating of copper plate, it can also be used as additive. Advantages: *High purity (*9.6%) *Unique crystal structure (sky blue crystal) *Extremely low Fe, Ph, As and P2O5 *Strong chelating ability *Excellent polarizing ability and current distribution *Fast plating, smooth layer *Stable plating solution *Strong anti-interference ability *Easy and simple maintenance While electroplating, our copper pyrophosphate has the following advantages: fast plating, smooth plating layer, regular, fine, tight, and no cavity crystal structure, stable plating solution, strong anti-interference ability, and simple maintenance.