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Custom PCB SMT Assembly
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Custom PCB SMT Assembly

FOB Price

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- Minimum Order

Country:

China

Model No:

-

FOB Price:

Get Latest Price

Place of Origin:

Shenzhen, China

Price for Minimum Order:

-

Minimum Order Quantity:

-

Packaging Detail:

Silica gel, bubble film, normal vaccum packing.

Delivery Time:

3-5 working days

Supplying Ability:

-

Payment Type:

T/T, Western Union, PayPal

Product Group :

-

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Shenzhen ZhongFeng Electronic Technology Co., Ltd

Shenzhen ZhongFeng Electronic Technology Co., Ltd

China

Free Member

Contact Person Ms. Thea

Shajing Street, Shenzhen, Guangdong

Contact Now

Product Specification

  • Brand Name: ZhongFeng
  • Number of Layers: 4-Layer
  • Base Material: FR-4 TG180
  • Copper Thickness: 1.6OZ
  • Board Thickness: 1.0mm
  • Surface Finishing: ENIG finishing, Gold 0.05-0.1um, Nickel 3-5um

Product Description

Layers: ***6 layers
Material: FR*4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Metal Core, Polyester, Polymide etc.
Board Thickness: 0.1mm*6.0mm (.**6"-.**6")
Copper Thickness: 1/2oz*6oz(*8um***0um)
Board size: **0mm****0mm
Min Tracing/Spacing: 0.**5mm/0.**5mm (3mil/3mil)
Min drilling Hole diameter: 0.*5mm(6mil), 0.1mm(4mil)-laser drill
Solder Mask: LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)
Silkscreen color: White, Blue, Black, Red, Yellow
Surface finish: Lead free HASL, immersion gold, golden finger, immersion tin, immersion silver, OSP, Carbon oil, plated hard gold(up to **0u")
Impedance tolerance: +/*5%~+/**0%
Chamfer of Gold Fingers: *0, *0, *5, *0
Test: Flying probe or Testing fixture
Quantity: From prototype to big volume, no MOQ
Assembly type: SMT, THT or Hybrid

 

Country: China
Model No: -
FOB Price: Get Latest Price
Place of Origin: Shenzhen, China
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: Silica gel, bubble film, normal vaccum packing.
Delivery Time: 3-5 working days
Supplying Ability: -
Payment Type: T/T, Western Union, PayPal
Product Group : -

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