Product Description

Our company is the leading manufacture for the diamond band saws, which are specially used for cropping and slicing the monocrystalline silicon ingots, in China. The saws are made by special technology with the stainless steel, that is most suitable for the cycle movement of saws, and the special diamond abrasives. The diameters, up to *2”, of monocrystalline silicon ingots can be cropped and the thinnest wafers of 1mm can be sliced up as well. The saws can perform high speed, long duration and smooth cutting surface of wafers. For more information please see our website at ***** .