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Diamond Cutting Wire for Silicon Wafering
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Diamond Cutting Wire for Silicon Wafering

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Country:

China

Model No:

0.12mm--0.4mm

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Contact Person Lisa

806# Building 1 Area A, AVICCITY International City, XingJin Road XingLin Wan, Xiamen, Fujian

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Product Specification

Product Description

Diamond Wire is effectively used for a variety of cutting applications: wafering, cropping, blocking, and squaring. The many benefits of cutting with diamond wire include: 2 - 3 times the throughput, lower cost of ownership, increased production, lower kerf, and equivalent wafer quality. Existing slurry saws can easily be converted to diamond wire to take advantage of the many benefits.

Country: China
Model No: 0.12mm--0.4mm
FOB Price: Get Latest Price
Place of Origin: -
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: -
Delivery Time: -
Supplying Ability: -
Payment Type: T/T
Product Group : -

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Lisa < XIAMEN LIVIYA CO.LTD >

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