Product Description

Product:2 layers /double sided PCB Base Material:HB, FR*1, FR*2, CEM*1, CEM*3; CEM*3 (Green), FR*4; FR*4 High Tg Min. Core Thickness:0.**4 mm (0.***5") Min. Board Thickness:0.4mm (0.**0") Types of Surface Finish:HASL, OSP, ENIG, Immersion Tin & Silver, Carbon Ink, Gold Fingers Min. Hole Size (Drill):0.*0 mm (0.**8") Via Hole:PTH, Plugged Hole, Blind & Buried, Silver Plugged Hole Aspect Ratio:8 : 1 Min. Line Width & Spacing:0.1 mm / 0.1 mm (4 mil / 4 mil) Min. Pitch Size:0.*0 mm (0.**2") Solder Mask :UV Curable, Photo Imageable, Peelable Type Profile:Routing, Punching, Chamfering, V-cut Warpage:0. 5% (Max) Impedance Control:+/- *0% or +/- 8%