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Epoxy Die Bonder

FOB Price

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1 Minimum Order

Country:

China

Model No:

HS-DC02

FOB Price:

(Negotiable) Get Latest Price

Place of Origin:

dalian

Price for Minimum Order:

Minimum Order Quantity:

Packaging Detail:

Delivery Time:

Supplying Ability:

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Jaf

China

Free Member

Contact Person Ms. sheila

dalian, dalian, liaoning

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Product Specification

Product Description

UPH: ***0(□1mm*□1mm) Wafer: Max 8 inches（**0mm） Wafer Table：**7.5×**7.5mm Chip Size: 0.2mm*0.2mm*2mm*2mm Application: Leadframes, PCB Dimension of Leadframe: L: 6.0″**1.4″(******0mm) W: 0.6″*3.*5″(****0mm) H: ***0mil (0.**0.*5mm) Demision: Unpack: ***0×***5×***6mm Packed: ***0×***0×***0mm Bonding Power: ******0g Bonding Accuracy: ±*0μm，±3o Compressed Air: 0.5MPa Voltage: **0VAC Power: ***0 W

Country:	China
Model No:	HS-DC02
FOB Price:	(Negotiable) Get Latest Price
Place of Origin:	dalian
Price for Minimum Order:	-
Minimum Order Quantity:	1
Packaging Detail:	-
Delivery Time:	.
Supplying Ability:	1
Payment Type:	-
Product Group :	-