Product Description

Shenzhen Juding Circuit Technology Co., Ltd., printed PCB circuit board process description.
PCB board customization, currently can be ***5 layers
Multilayer board impedance Multilayer board supports impedance design,
Sheet Type FR*4 Sheet Type: cardboard, semi-glass, full glass (FR*4), aluminum substrate,
Production process FR*4 sheet Traditional tin/immersion gold process
Maximum size *0cm * *0cm The size of the cut work plate is *0cm * *0cm, which usually allows the customer's PCB design size to be within *8cm * *8cm, subject to document review.
Solder Mask Types Sensitive Inks Sensitive inks are the most used type nowadays. Thermoset oils are generally used in low-grade single-sided cardboard. Such as green, blue, white, black, red, purple and other colors.
Finished outer layer copper thickness 1oz~2oz
(*5um~*0um) The default copper foil thickness of the conventional circuit board is 1oz, and can be up to 2oz (requires the order note).
Finished inner layer copper thickness 0.5oz (*7um) The default conventional circuit board inner layer copper foil line thickness is 0.5oz.
Dimensional accuracy ±0.2mm Board tolerance ± 0.2mm.
Plate thickness range 0.4~2.0mm Current production thickness:
0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm.
Plate thickness tolerance
(T≥1.0mm) ± *0% For example, the thickness of the plate is T=1.6mm, and the thickness of the material is
1.*4mm (T*1.6×*0%)~1.*6mm (T*1.6×*0%)
Plate thickness tolerance
(T Drilling hole diameter (mechanical drill) 0.2~6.3mm Minimum hole diameter 0.2mm, maximum hole diameter 6.3mm, if the factory is larger than 6.3mm, it should be treated separately. The mechanical drill has a specification of 0.*5mm as the first step, such as 0.2, 0.3mm.
Aperture tolerance (machine drill) ±0.*8mm The tolerance of the drill hole is ±0.*8mm, for example, a hole designed to be 0.6mm, and the finished hole diameter of the physical plate is acceptable from 0.*2 to 0.*8mm.
Line width 3.5mil multilayer board 3.5mil single and double panel 5 mil
Line gap 3.5mil multilayer board 3.5mil single and double panel 5 mil
Minimum via inner diameter and outer diameter Inner diameter (hole) minimum 0.2mm, diameter diameter minimum 0.*5mm Multilayer board minimum inner diameter 0.2mm, minimum outer diameter 0.*5mm, double panel minimum inner diameter 0.3mm, minimum outer diameter 0.6mm
Pad edge to line distance 5mil parameter is the limit value, try to be larger than this parameter
Through-hole single-sided solder ring 3mil parameter is the limit value, try to be larger than this parameter
Minimum character width line width 6mil
The character height *2mil parameter is the limit value, try to be larger than this parameter.
Single-chip shipment: the distance between the trace and the pad from the edge of the board is ≥0.2mm. Otherwise, the wiring and pads in the board may be involved.
Imposition V cut shipping:
The distance between the trace and the pad from the edge of the board is ≥0.4mm. Otherwise, the circuit and the pad inside the board may be involved. As shown in the right figure, if it is imposition, the line must have a 0.4mm spacing from the edge, otherwise the v cut will hurt the line. . If it is a single piece of shipment, you need to help ≥ 0.2mm spacing.
Minimum craft side 3mm
Jigsaw: no gap jigsaw 0mm gap jigsaw The gap between the board and the board is 0mm.
Jigsaw: There is a gap board 1.6mm gap board The gap of the gap imposition should not be less than 2.0mm, otherwise it is more difficult to rub the edge.
Half hole process minimum aperture 0.6mm Half hole process is a special process with a minimum hole diameter of not less than 0.6mm. Less than 0.6MM can not make half hole effect
The solder mask opening window 0.*5mm green oil bridge is less than 3mil, the green oil bridge is more than 3mil, and the soldering bridge is not used for inspection.