Product Description

Number of Layers 1~4 Copper Thickness 0.*0~2.0OZ Base Board Thickness 0.*2~0.*2mm Incombustibility *4V*0 Peelable resistance *2.3N/cm Insulation resistance ≥***1Ω Test voltage *****0V Finished board area **0×**0mm Min. Line Width and Spacing 0.1/0.1mm Copper thickness in hole 8~*5um Mini. pad diameter 0.1mm Mini. Hole Diameter 0.*5mm Hole tolerance PTH ±0.**6mm NPTH ±0.*5mm Hole location tolerance ±0.**6mm Solderable test **5 5 second Thermal cycling ability **8 *0 second Surface Finishing OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger Qaulity standard IPC-A****3 IPC-ML***0