Product Description

• Features:
  • Layer count: 4 layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: immersion gold
  • Solder mask: green
  • Copper thickness: 1oz
  • Min hole size: 0.3mm
  • Min line width and spacing: 4mil
  • The following is the whole manufacturer capacibility:
  • Item:
    • Material: FR*4/Hi-Tg FR*4/lead-free materials (RoHS compliant)/CEM*3, aluminum, metal based
    • Layer No: 1~*6
    • Finished board thickness: 0.**3.5mm (****8mil)
    • Board thickness tolerance: ±*0%
    • Cooper thickness: 0.**4oz (*****4um)
    • Copper plating hole: ****0um
    • Impedance control: ±*0%
    • Warp and twist: 0.*0%
  • Image:
    • Min trace width (a): 0.**5mm (3mil)
    • Min space width (b): 0.**5mm (3mil)     
    • SMD pitch (a): 0.2mm (8mil)
    • BGA pitch (b): 0.2mm (8mil)
  • Solder mask: 
    • Min solder mask dam (a): 0.***5mm (2.5mil)
    • Soldermask clearance (b): 0.**5mm (3mil)
    • Min SMT pad spacing (c): 0.**5mm (3mil)
    • Solder mask thickness: 0.****-inch (0.**8mm)
  • Holes: 
    • Min hole size (CNC): 0.2mm (8mil)
    • Min punch hole size: 0.9mm (*5mil)
    • Hole size tol:
      • TH: ±0.**5mm
      • NPTH: ±0.*5mm
    • Hole position tol: ±0.**5mm
    • Plating:
      • HASL/lead-free:
      • HASL: 2.5um
    • Immersion:
    • Gold nickel: **7um
    • Au: **5u-inch
    • OSP: 0.**0.5um
  • Certificates: RoHS, SGS, UL