Product Description

high accurate multi layer PCB board for LED

HDI board 
Application: communication, network, industry control, medical, electron fields
Layer No./ Thickness: *0L/1.1MM
Surface: ENIG
Line Width/ Line distance: 3.0/ 3.0MIL
Min. aperture: 0.1MM
Technical advantages: Third-order pile hole, Precise line, minimum aperture

Rigid-flex PCB
Application: Computers, communications, medical, automotive, aviation, military
Layer No./ Thickness: 6L/1.2MM
Surface: ENIG
Line Width/ Line distance: 5.0/ 5.0MIL
Min. aperture: 0.2MM
Technical advantages: Rigid-Flex, multiple-branching construction

HF board 
Application: Communications, military
Layer No./ Thickness: 5L/1.9MM
Surface: ENIG
Line Width/ Line distance: 9.0/ 9.2MIL
Min. aperture: 0.3MM
Technical advantages: Three steps groove structure

Buried core board 
Application: power transformer
Layer No./ Thickness: 4L/2.4MM
Surface: ENIG
Line Width/ Line distance: *2.2/ 4.2MIL
Min. aperture: 0.5MM
Technical advantages: blind via, Magnetic core embedded type structure


Brass Plate 
Application: ower supply modulem,Large current industrial control equipment
Layer No./ Thickness: 4L/3.0MM
Surface: ENIG
Line Width/ Line distance: *0/ *0MIL
Min. aperture: 0.8MM
Technical advantages: *8 OZ copper thickness 

Optical Communication Port PCB
Application: Communication 
Layer No./ Thickness: 8L/1.6MM
Surface: ENIG+Electric gold finger
Line Width/ Line distance: 4/ 4MIL
Min. aperture: 0.2MM
Technical advantages: Gold finger length structure, Appearance of high precision


Metal substrate 
Application:Audio equipment, Power supply module, LED
Layer No./ Thickness: 4L/3.0MM
Surface: ENIG
Line Width/ Line distance: 9.8/ 7.7MIL
Min. aperture: 0.*5MM
Technical advantages: high heat dissipation, Embedded type metal base

Back drill plate
Application: Communication 
Layer No./ Thickness: *2L/2.1MM
Surface: ENIG
Line Width/ Line distance: 5.0/ 5/0MIL
Min. aperture: 0.5MM
Technical advantages: Four high precision control deep drilling