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High reliability Copper Clad Laminate
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High reliability Copper Clad Laminate

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Country:

Hong Kong

Model No:

HR02

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Place of Origin:

Hong Kong & China

Price for Minimum Order:

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Free Member

Contact Person Mr. Craigavon

6-8, Dai Wang Street, Tai Po, Hong Kong, Goung Dong

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Product Specification

Product Description

High Tg (> **0 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > **0 oC by TGA) Lead free process compatible (**0 oC IR reflow 6x + **8 oC solder flow 6x, no delamination) Lower Coefficient of Thermal Expansion (< 3.0% from *0 � **0oC) High heat resistance demonstrated by T***0, T***8 and T***0 T***0 > *0 min. T***8 > *0 min. T***0 > *0 min. Over *5 cycles by thermal stress **8 oC and **0 oC, *0 sec solder float. CAF ***0 hrs Min board thickness: 2 min Prepreg: ***8, ***6, ***0, ***3, **6

Country: Hong Kong
Model No: HR02
FOB Price: Get Latest Price
Place of Origin: Hong Kong & China
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: -
Delivery Time: -
Supplying Ability: -
Payment Type: -
Product Group : Copper Clad Laminate

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Mr. Craigavon < Mica-AVA (Far East) Industrial Ltd >

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