Looks like you are not TradeKey.com's Member yet. Signup now to connect with over 10 Million Importers & Exporters globally.
Join Now, its Free |
BOOK A CALL
Book Call On Your Favorite Time

By Signing Up. I agree to TradeKey.com Terms of Use, Privacy Policy, IPR and receive emails related to our services

Contact Us
product
Prev
Movable pre-heating zone automatic bga rework station DH-A7C Movable pre-heating zone automatic bga rework station DH-A7C Movable pre-heating zone automatic bga rework station DH-A7C
Next

Movable pre-heating zone automatic bga rework station DH-A7C

FOB Price

Get Latest Price

52000 ~ 66000 / Set ( Negotiable )

|

1 Set Minimum Order

Country:

China

Model No:

-

FOB Price:

52000 ~ 66000 / Set ( Negotiable ) Get Latest Price

Place of Origin:

China

Price for Minimum Order:

52000 per Set

Minimum Order Quantity:

1 Set

Packaging Detail:

Wooden box

Delivery Time:

30 days

Supplying Ability:

20 Set per Month

Payment Type:

T/T, L/C, Western Union

Product Group :

-

Contact Now
Free Member

Contact Person Roger

Shenzhen, Guangdong

Contact Now

Product Specification

  • Product Name:Automatic BGA rework station
  • Heating:3 independent heaters
  • Applicable BGA chip:1*1mm-80*80mm
  • Application:Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc
  • Temperature control:K-type thermocouple closed loop
  • Temperature accuracy:±1â

Product Description

. Function/Features:

1. Large preheating area which can repair the maximum size of **0***0 mm super large motherboard;
 
2.The lower temperature area can be moved around **0 degrees, evenly heating the pcb in every corner, to ensure that the pcb does not deform;
 
3.Optical counterpoint, chip mount counterpoint precision, completely avoid dislocation offset;
 
4.Automatic disassembly, welding, recovery of chips, completely liberating workers;
 
5.The preheating area adopts infrared luminous tube, fast heating, stable constant temperature, environmental protection and energy saving, beautiful appearance
Touch screen operation, preset program, which can be used proficiently without professional technical training, making chip repair very easy;

6.Touch screen operation, program built-in advance, without professional technical training can be skillfully used, so that the chip repair becomes very simple;

7.External USB interface, used for software update and upgrade and import of various repair data into computer analysis and storage;

8.The operation panel can be pulled out to the operator for easy operation;

9.Suitable for a variety of patch devices to repair (SOP, SOJ, QFP, QFN, BGA, PLCC, SCP.....);

*0. Docking MAS system function can be added if need.

. Product parameter
Power Supply AC*80V±*0     *0/*0Hz
Total Power 95*0W
Top heater ***0W 
Bottom heater 8*0W
IR preheating area *2*0W (Germany heating tube, heating area of **0 *750mm)
Operation mod Fully automatically disassemble,suction,mounting and soldering. The preheating area and the tray can move freely around the X and Y axis to meet the different position distribution of the BGA chip on the PCB
Dimensions L***0×W***0×H***0 mm
Basic configuration Automatic feeding delivery system+HD digital camera+Japanese Misumi suction rod system+Panasonic CCD optical counterpoint system+HD digital display PC +upper computer+Panasonic servo+Panasonic PLC+a *0-inch digital touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian Institute of Technology **-channel temperature control system+ American Omega Temperature measurement system+High fever efficiency and heating tube+ Resistance to ***0 degree black crystal sand glass
Chip feeding system Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage ****0 groups
Optical CCD lens Automatic stretch out and go back, which can be moved freely before and after the rocker, to eliminate the "observation dead corner" problem
IR preheating area **0×**0mm
Chip angel adjust Φ Angle can be **0° rotation, precision fine tuning fitting suction nozzle
PCBA Positioning Up and down intelligent positioning,bottom "*-point support" with V-groove fixed PCB which can be adjusted freely in the X-axis direction,  with universal fixtures meanwhile
BGA position Laser positioning to quickly find the vertical point of the upper and lower temperature zone and the central point of BGA
Temperature control K-type Sensor,Closed loop and 8~*0 segments for temperature controlling program
Temperature accuracy ±1 
Placement Accuracy +/*0.*1mm
CCD system A CCD HD digital camera, 2 million pixels, automatic optical zoom, laser positioning
Pressure sensor Inductive pressure greater than ****0G (set up) will initiate collision pressure protection
Safety guard pressure sensor + infrared sensor. Double guard.
Workbench fine-tuning Back/front±*5mm,left/right±*5mm
PCB size Max **0×**0 mm  Min *0×*0 mm
PCB thickness 0.***5mm
BGA chip 2×*-*0**0mm
Gas source External gas source + gas source filtration system
Gas media air or nitrogen or argon (non-air media is required to add more configuration)
BGA suction mode Negative pressure vacuum suction, automatic induction release in place
BGA weight ****0g (special specification customization)
Minimum chip spacing 0.*5mm
External Temperature Sensor 5 pcsoptional)
Machine type floor type
Net weight Appro **0kg
 

 

Country: China
Model No: -
FOB Price: 52000 ~ 66000 / Set ( Negotiable ) Get Latest Price
Place of Origin: China
Price for Minimum Order: 52000 per Set
Minimum Order Quantity: 1 Set
Packaging Detail: Wooden box
Delivery Time: 30 days
Supplying Ability: 20 Set per Month
Payment Type: T/T, L/C, Western Union
Product Group : -

Send a direct inquiry to this supplier

To:

Roger < Shenzhen Dinghua Technology Development CO., LTD >

I want to know: