Product Description

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A***0G Class II

. IPC-A***0G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.**8" (0.*0mm)

Micro vias diameter: 0.**4 TO 0.**0 inches (0.*0 - 0.*5mm)

Minimum line width/spacing: 0.**4/0.**4 inches (0.*0mm/ 0.*0mm)

Maximum copper thickness: 5oz (**0um)

Thin board thickness:

. DS - 0.**8 inches (0.*0mm)

. 4/L - 0.**6 (0.*0mm)

. 6/L - 0.**0 inches (0.*0mm)

Maximum board thickness:

. **5.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Other:

. Account of layers: Double-side to above *0 layers (1 to *0 layers)

. Max PCB dimensions: *3 x *5 inches (**4.2 x **9.0mm)

. Solder mask bridge between solder dam: 4mil (0.*0mm)

. Minimum solder mask annular: 1.5mil (0.**8mm)

. Min thickness of solder mask: 0.*0mil (*0um)

. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask

. Min height of Legend: 4mil (0.*0mm)

. Min width of front: *5mil (0.**5mm)

. Legend colors: White, yellow, black

Data format: GERBER, PROTEL, PADS***0, Powerpcb, ODB++

Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating

Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.