Product Description

Specifications:
Layers: 2
Base material: FR4
Copper thickness: 1oz
Board thickness: 1.0mm
Min. hole size: 0.*5mm
Min. line width: 3 mils
Min. line spacing: 3 mils
Surface finishing: HASL

Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: **0 x 1,**0mm
Hole diameter: 0.2mm (minimum)
Line width: 0.**5mm (minimum)
Line spacing: 0.**5mm (minimum)
SMT pitch: *0° (minimum)
Annular ring: 0.*5mm (minimum)
Aspect ratio: *1:*1
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.*5mm
Hole tolerance (NPTH): 0.*5mm
SM tolerance (LPI): Dimension
Electrically test: supported
With RoHS Directive-compliant
Possibility of SMT device mounting: supported