Product Description

In ***1, Shenyang Academy of Instrumentation Science started to research and manufacture silicon piezoresistive wafers. With excellent technology and well educated employees, we become the market leader in China for piezoresistive die.

We establish our reputation for cost-effective and quality. The pressure dies have been employed in pressure transducers widely in the world.

Features:
Self-intellectual property and manufacture workmanship silicon Micromachining
4"Silicon wafer workmanship flow and controllable workmanship in batch production, various ranges
Tiny size structure, high consistency and economical wholesale price
High accuracylong stability and reliability

Specifications
*1            Nominal Scale    *5KPa,**0KPa,**0KPa,  **0KPa,1MPa,1.6MPa,2.5MPa,6MPa,                                                                         *0MPa,*5MPa,*0MPa,*0MPa
*2    *                    ≤*@********************n Output    ≥*0mA(≤*5KPa) ; ≥*0mV (other scale)
*4    Nonlinearity    ±0.*5%F.S.
*5    Power Supply    1 mADC (typical), 5V (optional)
*6    Zero Temperature Coefficient     ±0.1%F.S./ ºC
*7    Sensitivity Temperature Coefficient    ±0.1%F.S./ ºC (≤*5KPa)  ±0.*5%F.S./ ºC (other scale)
*8    Overload Capacity    2 times scale(≤*0MPa);1.5times scale(>*0MPa)
*9    Bridge Resistance    5 (1±*0%) KΩ
*0    Operating Temperature    **5ºC ~ ***0ºC
*1    Short Term Stability    ±0.*5%F.S./8h
*2    Chip Size(um)    ***0×***0    ***0×***0

Notes    1.Calculating method of nonlinearity is the Least Squares Method.
             2.Short Term Stability is tested under *5ºC,5VDC.
             3.Other results are attained with the reference temperature *5ºC,1mADC.
             4.Silicon wafer thickness c=**0um,glass thickness d=**0um