Product Description

Layer Counts: 4 Material: FR*4 Maximum: Size **0 X**0mm Board Outline Tolerance: +/*0.*3mm Board Thickness: 0.*0mm***6.*0mm Thickness Tolerance(t!Y0.*0mm): +/*8% Thickness Tolerance(t<0.*0mm): +/**0% Insulation Layer Thickness: 0.**5mm***6.*0mm Minimum Line: 0.**5mm Minimum Space: 0.**5mm Out Layer Copper Thickness: *2um*****5um Inner Layer Copper Thickness: *2um*****5um Drilling Hole (Mechanical): 0.*0mm***6.*5mm Finish Hole (Mechanical): 0.*5mm***6.*0mm Diameter Tolerance (Mechanical): +/*0.*8mm(PTH); +/*0.*5mm(NPTH) Registration (Mechanical): +/*0.**5mm Laser Hole: 0.*0mm Aspect Ratio: *0:1 Solder Mask Type: LPI SMT Mini. Solder Mask Width: 0.*8mm Mini. Solder Mask Clearance: 0.*5mm Plug Hole Diameter: 0.*5mm***0.*0mm Impedance Control Tolerance: +/**0% Wrap/Twist: 0.*5% Surface Finish: HASL, I mmersion Gold