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Bonda Technology Pte Ltd

Anson Road,singapore,singapore,Singapore

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Sapphire Wafers



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Product Specification

Brand Name : -

Product Description

Crystal Materials 99.999%High purity, Monocrystalline Al2O3
Wafer Surface Orientation C-axis [0001] off M [*-100]
0.2°± 0.05°/ 0.3°± 0.1° 0.3° ± 0.25°
Diameter 50.8mm ± 0.1mm / 76.20mm ± 0.25mm/ 100.0 ± 0.40mm
Thickness 500um ± 10um 430um ±10um 330um ± 15um
Major Flat A-axis [*1-20] ± 0.5°
Major Flat Length 16.0mm ± 1.0mm / 22.0mm ± 1.0mm / 32.5 ± 1.0mm
Minor None    
Front Surface Finish Epi polished, Ra< 0.20nm
Back Surface SSP: Fine ground, Ra 0.4 to 1.0 um; DSP: Polished
Edge condition Edge defects not to exceed SEMI M3-91
TTV <10um <10um <15um
BOW <10um <10um <15um
Warp <10um <10um <15um
Bubble & Color None by visual inspection in intensive light
Ground Boundary None by visual inspection in fluorescent light
Cleanliness Free visible contamination
Packaging Packaged in a class 100 clean room environment, in cassettes of 25 or single fluroware, under a nitrogen atmosphere


Note: Customerized specifications are also available.


Contact Us

Contact Person :Ms. Jane

Company:Bonda Technology Pte Ltd

Address:Anson Road, singapore, singapore, Singapore,079903


Ms. Jane < Bonda Technology Pte Ltd >
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