Product Description

Feature: This kind of laser machine uses Semi-conductor laser, with excellent beam quality and less operation cost, so you can save more efforts on the maintenance. The most important parts are imported. So this machine is with high-speed scribing and high-level precision, and the working hours can last *4 hours. Application: This kind of laser machine is capable of scribing various silicon wafer in solar industry and cutting in electron industry. Technical Parameters: Wave length 1.**4μm Scribing precision ≤±*0μm Max scribing depth : 1.2mm Scribing line width : ≤*0μm Laser repeated frequency : **0Hz～*0kHz Max scribing speed : **0mm/s Max laser power : ≥*0W Worktable size : **0×**0mm Power supply : **0V（**0V）/ *0Hz/ 5kVA Cooling mode: cycling water cooling under the constant temperature