Product Description

The sparse pin fin configuration allows weak incoming air streams to efficiently enter and exit the pin array, thus providing efficient cooling in low airspeed environments
Googe is committed to the provision of custom parts in a cost effective fashion, . Customizable parameters include length, width and height
Googe's heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
Sparsely configured pin fin heat sinks range footprint must be less than 2.*0" x 2.*0" Technical Data:
Manufacturing Technology
Sparse pin fin heat sinks for Power devices are manufactured via the Cold Forging process
The cold forging process allows for the use of highly conductive aluminum alloys
The process ensures that no air bubbles, cavities or any other impurities are trapped within the material
Materials
Aluminum pin fin heat sinks are forged from pure aluminum (AL***0)
The thermal conductivity of AL ***0 is ***0 BTU/in ft2 hr of. (~*0% higher than AL **0, a common cast alloy)
Base Finish
Pin fin heat sinks for SM devices are lapped
The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
Flatness: Better than 0.**1 inch/inch
Surface Finish: *6 RMS or better
Plating (optional)
Anodize - black, hard black, clear, red
Nickel (electroless or electrolytic)
All heat sinks are 6/6 RoHS compliant Airspeed(LFM): ****0 Material: Al, Cu Footprint: Less than 2.*0× 2.*0