This series product is with organic silicone as the main raw material, add the thermal conductive filler of heat resistance and heat conduction performance, to make a rubber type of the thermal conductivity filler . 

  Under the premise of remaining high thermal conductivity, fall hardness  below *0 degrees (shore *0), greatly reduces the stress on the kinds of complex space, small aperture, can realize automatic generated in situ forming method. This series is a type of colloid, don't need to assembly device, its low modulus at the same time, to make it can be adaptive filling all  placed after curing, save time, improve production efficiency.