Thermal conductivity; efficient heat transfer
Superior electrical insulation
Rapid cures
Outstanding dimensional stability
Capable of passing NASA low outgassing
Unlimited working life at room temperature
Kohesi Bond TUF ***3 HT-CM is a toughened, single component system
that requires no mixing and cures readily at elevated temperatures.
Although it requires a minimum temperature of **0°C for curing (at
which it cures extraordinarily fast), it can achieve even faster
cures at higher temperatures. TUF ***3 HT-CM offers an extensive
serviceable temperature range of **0°C to ***0°C. This product can
withstand severe thermal cycling and shocks. Being a one component
system. it provides ease of application and also adheres well to a
wide variety of substrates including metals, ceramics, composites,
most plastics and glass. It provides outstanding bonding and
physical strength properties, as well as dimensional stability. TUF
***3 HT-CM is a **0% solids system i.e. it does not contain any
solvents or diluents. In addition to superior electrical
insulation, TUF ***3 HT-CM also offers very good thermal
conductivity. It has a black color. It also extends phenomenal
chemical resistance to a variety of acids, bases, fuels and water.
TUF ***3 HT-CM although most commonly used for glop topping, its
superior performance and the ability to pass NASA low outgassing
standards, makes it suitable for use in various electronics,
aerospace and vacuum applications.
TYPICAL
APPLICATIONS: Bonding
& Sealing, Coating, Potting, Glob
Top, Die
Attach
