Product Description

Tunsten copper heat sink is a component or an assembly which transfers heat generated within a solid materia to a fluid medium,such as air or a liquid to prevent thermal damage.Tungsten copper electronic packaging is used as heat sink pieces and encapsulation shell.
Tungsten copper heat sinks are developed with unique features such as certain mechanical strength ,good electrical properties,thermal properties and chemical stability.
tungsten copper heat sinks are extensivelyused in thermal mounting plates,chip carriers,flanges,and frames for RF,microwave millimeter wave packages like LDMOS FET,MSFET,HBT,Bipolar,HEMT,MMIC,light emitting diodes and detectdrs,laser diode packages like pulse,CW,single emitter,bars and complex carriers for optoelectronics amplifiers ,receivers,transmitters,tunable Lasers.