Product Description

1）Applied in semiconductor wafer’s cleaning and etching;　 　　 2）Process flow:Designed as customer required, used in cleaning, etching, plating, stripping, polishing and etc. 3）Control mode: Manual, semi-auto, Auto.; 4）Material:Depending on process and customer requirement, available matierials eg.PP, PVC, PVDF, Quartz Tube, Stainless steel and others; Features and benefits:  A. Module design;Depending on customer requriment and process, offer special solution; B. Customization based on customer budget; C. Optimum wet cleaning solution; D. High PPR; E.Various options available:; F. Operator friendly and safe; G. Easy maintenance;