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South Korea
Contact Person Mr. Young
105-105, Byeoksan Blooming, Won Gok 2 dong,, Ansan, Gyeonggi-do
1. Application Shielding for Electronic casings & frames EMI Countermeasures for PC and etc 2. Features Elcellent EMI shielding effectiveness Good electric contact due to using of adhesive tape Grounding effect owing to direct with conducitve fabric in embossing type Reasonable cost 3. Specification - Conductive Fabric: Thickness : 0.1 mm (Typical Value), Ripstop/Cu + Ni, Woven/Cu + Ni, Au - Elastomer : Density : *5±3Kg/ã¥, Polyurethane foam - Conductive Adhesive Tape : Min. **0gf/*5mm, mesh/fabric conductive adhesive
