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South Korea
Contact Person Mr. Young
105-105, Byeoksan Blooming, Won Gok 2 dong,, Ansan, Gyeonggi-do
Thermal is a combination of high thermal conductivity and superior flame-retardancy with specific organic properties of heat resistance and electrical insulation. Thermal offers excellent heat transfer between heat sink and semiconductor package surface where surfaces are rough 1. Application - Cooling componts to the chassis or frame - High speed Mass storage Drive -RDRAM Modules -Micro processors, memory chips and chipsets 2. Characteristics NTEST ITEM 1. Color ->Dark Gray ( but, buyer&#**9;s option available) 2. Thickness(mm) ->0.5~*0±*0% 3.Hardness(Shore *0(HS) ->*5±*0 4.Specific Gravity(g/ã¤) ->2.4 5. Dielectric Strength(KV/mm) ->6< 6. Using Temperature(°C) ->**0~**0 7. Flame Resistant Properties ->UL *4 V*0 *4 V*0 8. Thermal Conductivity(W/mk) ->1.5( but, buyer&#**9;s option available)
