Description

Features:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.
2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save *0 groups of temperature curves at the same time.
3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.
4. Choose imported high-precision thermocouple to detect top/bottom temperature precisely.
5. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.
6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.