Description

Specifications: 
1. Total power: ***0 W
2. Top heater: **0 W
3. Bottom heater: ***0 W
4. Power supply: single-phase **0 VAC *0/*0Hz 3KVA
5. Machine Dimension: **0 × **0 × **0mm
6. Temperature control: high-precision K Sensor
7. Positioning: V-groove for PCB positioning, Max PCB size: **0 × **0mm
8. Weight: About *5 kg

Features:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.
2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save *0 groups of temperature curves at the same time.
3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.
4. Choose imported high-precision thermocouple to detect top/bottom temperature precisely.
5. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.
6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.