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Futian tariff-free zone, Shenzhen, Guangdong
Main Base Material: FR4, CEM3, High Frequency Laminate with various dielectric constant, Aluminum base laminate, Ceramic base laminate. Copper Foil Thickness: 1/3oz*5oz Max. size : **0****0mm Min. Finished Board: 2**0mm Min. hole size: 8mil/0.2mm Min. line width: 8mil/0.2mm Min. spacing :8mil/0.2mm Solder Mask Type: Liquid photoimageble Outline Tolerance :+/- 0.**7mm Surface Finsih: Hot air Leveling, Electroless Ni/Immersion Au, Electrical Ni/Au, OSP Coating, Hard Gold plating , Immersion Tin, high abradability Gold Inner Layer registration tolerance: +/*0.*5mm
