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Contact Person Ms. Amber
WENCHANG TOWN, Hangzhou, Zhejiang
It is mainly applied to soft (hard) PU foam, epoxy resin , polystyrene, acrylic acid, cellulose acetate, ethyl cellulose resin, bakelite, polyvinyl acetate, and foam gap filler, especially for thermal conduction of hard PU foam and stability of hydrolyze, as well as for the synthetic PU foam and saturation resin and bakelite with low viscosity under low temperature. Phosphor content % : 9.5 moisture %: ⤠0.*0 chlorine content % : *2.5 acidity mgkoh/g: ⤠0.*6 *Remark : If customer has any specific requirements on moisture and/or acidity, please show us. If you have any question or need, please contact us by e-mail:*****
