Description

Micro laser perforation technology Laser perforation in general, possible to perforate by pulsed or enlarged focused laser beams are holes sizes from *****0 microns at density of holes of typically ****0 holes per cm, holes sequences **0, ******0, **0 holes per second at a maximal of *6 punctured laser rows cross web with traditional systems or machines. Means in cigarette, tipping, plug wrap, filter, flexible packaging, packs, tear tape, plastic and other material webs. With porosity levels from ****3, **0 C. U., normally in web widths from ******0 mm, in particular cases up to 1, **0mm, at web speeds of up to **0 m/min, depending on porosity and material consistency in relation to its ability to perforate. IPM laser cluster material treatment and micro perforation technology LPM*1 is patent granted by DE***********7, operates with quadruple Co2 carbon or other laser beam inputs up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to **0 individual laser output channels and perforation rows cross web. Combines automatic positioned laser perforation heads, focus setting, web speeds up to **0 m/min, web widths up to 2, **0mm, up to 2, **0, **0 holes per second, jumbo roll-by-roll production, optical inline permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can achieve ****1, **0 C.U. The conception of high power twin level laser beam multiplexer enables hundred options in other industry application fields as cutting, cut-off, welding, surface finishing, high-speed drilling, ablation, cleaning, micromachining, polishing, forming, melting, surface treatment, roughness improvement. Each up to **0 single laser beams is coupled via flexible hollow fibers allows treatment processes or micro perforation heads easy to position in X across and in Y direction of running web or static placed sheet material.