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Multilayer board with BGA pads, chemical gold, breakrouted

Multilayer board with BGA pads, chemical gold, breakrouted

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Gusheng Technology Co., Ltd

Gusheng Technology Co., Ltd

China

Free Member

Contact Person Ms. Eunice

Fuyong, Shenzhen, Guangdong

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Description

Layer: 1Layer~Multilayer Min Trace&Space: 4mil/4mil Material: FR*4, High Tg FR4, Aluminium Core Etc Thickness: 0.2mm~6.0mm Cu(In/Ex): 1oz~4Oz Finish: OSP, HASL, Gold Plating, Immersion Gold Min Hole: 0.1mm vacuum packaging

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