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Contact Person Mr. charlie

donghuan, Shenzhen, Guangdong

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Description

General Characteristics Features Product Multicrystalline silicon wafer Growth Method Directional solidification Conductivity Type P type Dopant Boron Resistivity 1~3Ω.cm Oxygen Content 1Ã*0 *8 atom/cm 3 Carbon Content 4Ã*0 *7 atom/cm 3 Structural Characteristics Features Side **6.0mm ± 0.5mm Corner diagonal 1.5mm ± 0.5mm Life time 2us*3us Corner Angle *5°±*0° Thickness **0±*0Î&frac*4;m Surface No stain or splash on surface Mechanical Characteristics Features TTV â¤*0Î&frac*4;m Bow â¤*0Î&frac*4;m Surface No defect Saw Mark â¤*5Î&frac*4;m

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Mr. charlie < TOPSKY Electronics Technology Limited of Hong Kong >

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