Description

IT****2 is a silicone based heat sink compound is designed to improve thermal flow and conduct away heat. Used as a thermal transfer media for facilitating dissipation of heat between power components, the paste forms heat conducting layer on electronic instruments like transistors, diodes etc.

The product features outstanding thermal conductivity and exhibits an excellent resistance against chemicals. It is non-toxic and compatible with most plastics. The compound has very high oxidation stability and resists temperature. It shows a minimal oil separation.