Description

Purpose of equipment: For die-cutting of chips with different specs for embedding into milled card slots, realizing IC packaging and testing.

Features:
1. Provided with functions of die-cutting, wmbedding, packaging and testing of IC modules, realizing high integrity and easy operation of the equipment.
2.Specially available for packaging of single-chip card. double-chip card and four-chip card, where the later can be packaged through only one complete process.
3.The feeding structure with high strength synchronous belt and servo motor is used, ensuring high efficiency feeding and low noise.
4. Available card positioning adjustment structure, ensuring accurate module packaging.
5. The servo and high precision screw structure used for module conveeyance can help to ensure high precision, reliable operation and long service life.
6. A water circuit cooling system is involved in the module hot welding process, meeting different temperature requirements for hot-melt adhesive packaging.
7. A tester is used for module testing for ensuring quick and accurate testing of products.
8. The operation of the equipment can be monitored automatically, and any error and the corresponding solution can be shown on the man-machine interface in case of malfunction,
9. The color friendly man-machine interface is used for high efficiency and easy operaton.

Technical parameter: