Description
Spot Bonding Machine
YCD*2
The spot bonding
machine YCD*2 is used for preparation process before lamination to
ensure lamination quality. This machine adopts electric heating,
and the spot bonding pressure and time are adjustable, and the
bonding spot is smooth. The spot bonding head is movable in the
full range of guide.
Technical
parameters
1. Applicable
material: PVC or other plastic material
2. Size
of material (max.): **0×**0
3. Thickness
of material: 0.**1.0 mm
4. Pressure:
0.6MPa
5. Heating
temperature: <**0</span>ºC
6. Temp.
control: ±2.0ºC
7. Number
of bonding head: 2 groups
8. Productivity:
**0 sheets /hr.
9. Power
supply: AC**0V *0/*0Hz single phase *-wire
*0. Power:**0W
*1. Weight:
approx.30kg
*2. Dimension:
L**0×W**0×H***0mm
Spot Bonding Machine
YCD*3
The spot bonding
machine YCD*3 is used for preparation process before lamination to
ensure lamination quality. This machine adopts electric heating,
and the spot bonding pressure and time are adjustable, and the
bonding spot is smooth. The spot bonding head is movable in the
full range of guide. The lamp is installed under the working table
for checking whether the inner coil location inside RFID card PVC
layer is correct or not before.
Technical
parameters
1. Applicable
material: PVC or other plastic material
2. Size
of material (max.): **0×**0
3. Thickness
of material: 0.**1.0 mm
4. Pressure:
0.6MPa
5. Heating
temperature: <**0</span>ºC
6. Temp.
control: ±2.0ºC
7. Number
of bonding head: 3 groups
8. Productivity:
**0 sheets /hr.
9. Power
supply: AC**0V *0/*0Hz single phase *-wire
*0. Power:
**0W
*1. Weight:
approx.40kg
*2. Dimension:
L***0×W**0×H***0mm
