Description

1, Materials: CEM3, FR2, FR4 and AL
2, Processes: HASL, Au plating, Au/SP immersion and OSP
3, Layers: 1 to *2
4, Conventional coating: ***1, ***2, ***3, ***5, ***0 and ***2 placement 5, Minimum precision:BGA: 0.5mm IC: 0.4mm
6, PCB fabrication, hand insertion, metal assembly and function test
7, Experienced components sourcing team
8, Specially for scarce parts
9, 1 to *2 layers mixed assembly technology
*0, Specialized in assembling boards for safety, industry control and power boards
*1, Type of production line and supports:SMT (Yamaha and Sanyo machine)
*2, Plastic injection factory
*3, Die-cast and sheet metal stamping factory
*4, X-ray/ICT test, function test and assembly line
*5, One stop station EMS services provider
*6, Various specifications are available